Frequently asked questions

QubitPack is a semiconductor design and engineering studio. We design advanced packaging — TSV and wafer-scale interconnect architectures — for quantum hardware teams, and we advise them on wafer specification, packaging strategy, and foundry selection. We are also developing a software platform for packaging engineers.

No. We do not run a fab. We design and advise, then hand off complete design files to the foundry our client chooses to build with. Staying independent of any one production line is deliberate — it keeps our guidance focused on what is best for your device.

QubitPack was founded in March 2026 by Khalid Butt to bring serious packaging-design expertise to the emerging quantum hardware community.

We support teams across quantum computing, quantum sensing, and quantum communications — the three pillars of the emerging quantum technology ecosystem.

You receive complete packaging design files and documentation — TSV and interconnect layouts drawn against your foundry’s Process Design Kit — packaged for a clean handoff, along with the design-for-manufacturing reviews behind them.

Not yet. The design and analysis platform we are building for packaging engineers is still in development and pre-launch. It shapes how we work today, but it is not publicly available.

Yes. Engagements range from a focused technical consult — a single design review or a foundry-selection opinion — through to a complete packaging design from specification to handoff.

Reach out through our contact page with a few details about your device and constraints. We will follow up to schedule a discovery conversation and scope the work.