Perspectives from the quantum frontier
Engineering notes, industry analysis, and company updates on the technology shaping the future of computing.
Designing TSV architectures for quantum interconnect density
Through-Silicon Vias are where a quantum package lives or dies. We walk through the design trade-offs — density versus signal integrity, placement versus thermal budget — and how we approach a TSV layout that a foundry can actually build.
Read article →Through-Silicon Vias: the vertical highways of quantum hardware
TSV and wafer-scale bumping unlock interconnect densities that classical packaging cannot reach. Here is why they matter for the next generation of qubits.
Design-for-manufacturing: catching problems before the fab does
A layout that ignores foundry rules is a layout that fails on silicon. We look at how reviewing designs against a real PDK saves months and money.
The case for independent packaging design in the quantum era
A design partner with no fab of its own can give advice that serves the device, not a production line. We make the argument for independence.