QubitPack
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Design and engineering for quantum hardware

QubitPack is a semiconductor design and engineering studio. We work across three practices — packaging design, technical consulting, and a software platform in development.

Practice 01

Packaging & Interconnect Design

We design the advanced packaging that quantum devices depend on — TSV architectures and wafer-scale interconnect layouts — delivered as clean, buildable design files for the foundry you choose.

What you receive

  • TSV architecture design and floor-planning
  • Wafer-scale bumping and interconnect layouts
  • Design-for-manufacturing (DFM) reviews
  • Design files and documentation for your foundry
Practice 02

Technical Consulting

Independent, vendor-neutral guidance for teams making early packaging and manufacturing decisions. Because we do not run a fab, our advice is only ever about what is right for your device.

What you receive

  • Wafer and substrate specification
  • Advanced packaging strategy
  • Foundry evaluation and selection
  • Process-readiness reviews
Practice 03 · In development

Software Platform

We're building a design and analysis tool for packaging engineers — a workspace that checks interconnect layouts against foundry rules as you work. The platform is pre-launch and not yet available.

What you receive

  • Interconnect layout and design capture
  • Automated design-rule and PDK checks
  • Signal-integrity and density analysis
  • Foundry-ready export (planned)

Bring us in early

The best time to get the packaging right is before you commit to a foundry. Tell us where your device is today and we will map out how we can help.